News
20-nm FPGAs meet interconnect needs with fine-pitch copper bump...
www.eenewseurope.com
Altera and TSMC have announced that they are to use TSMC’s fine-pitch copper bump-based packaging technology for Altera’s 20 nm Arria 10 FPGAs and SoCs. Altera...
Altera and TSMC Collaborate to Bring ChipEstimate.comwww.chipestimate.com › TSMC › news
www.chipestimate.com
... the highest-density monolithic 20 nm FPGA die in the industry," said Bill Mazotti, vice president of worldwide operations and engineering at Altera.
PG&E shuffles top executives; utility CEO out / Consumer groups,...
www.sfgate.com
Peter Darbee, 52, already president and chief executive officer of PG&E, will add the...
Altera and TSMC develop industry-first UBM-free WLCSP packaging...
www.packaging-gateway.com
· Altera vice-president of worldwide operations and engineering Bill Mazotti said: "Altera's work with TSMC has produced a very advanced and ...
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