News
Flip chip bonder install and training Feb 22kth.se
www.aphys.kth.se
— A flip-chip bonder from Paroteq suitable for small chips has been purchased by QNP and will be installed February 22nd.
Hanmi launches new flip chip bonder for high-end chipsTHE ELEC, Korea Electronics Industry Media
thelec.net
— Hanmi Semiconductor has launched its new Flip Chip Bonder-5.0 aimed at high-end semiconductor production, the company said on Tuesday.
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