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patentbuddy: Dirk Tobben
QIMONDA AG, Munich, DE
Bücher
FOR ULSI MULTILEVEL INTERCONNECTION …
www.gbv.de
FOR ULSI MULTILEVEL INTERCONNECTION CONFERENCE February ,1998 Monday, February 16, OPENING SESSION - 9 A.M Chairman: Dr. Dirk Tobben …
Certain Integrated Circuits, Processes for Making Same, and Products...
books.google.de
Dr. Schutz met Dirk Tobben in August and Dirk Tobben worked for Dr. Schutz. JX-31C, Schutz Dep. Tr. 9:21-10:line When Dr. Schutz started work ...
Official Gazette of the United States Patent and Trademark Office:...
books.google.de
... Dirk Tobben , Langebrueck , Germany , and Jeffrey Gambino , the electronic component having a pair of opposing sidewalls Westford , Vt . , assignors to ...
Dokumente zum Namen
Certain Integrated Circuits, Processes for Making Same, and ...
www.usitc.gov
— Dirk Tobben, Bruno Spuler, Marin Gutsche, and Peter Weigand were all working for. Siemans or for some organization under Siemans in August ... › publications › pub3624
Wissenschaftliche Veröffentlichungen
dblp: IBM Journal of Research and Development, Volume 43, 1999
dblp.uni-trier.de
Bibliographic content of IBM Journal of Research and Development, Volume 43, 1999
dblp: Douglas S. Armbrust
dblp1.uni-trier.de
List of computer science publications by Douglas S. Armbrust
Donna R. Cote - dblp
dblp.uni-trier.de
Donna R. Cote, Son Van Nguyen, Anthony K. Stamper, Douglas S. Armbrust, Dirk Tobben, Richard A. Conti, Gill Yong Lee: Plasma-assisted chemical vapor ... › pid
Sonstiges
EP A3 - Planarization of a non-conformal device layer in...
patents.google.com
Other languages: German: English: French; Inventor: Matthew Sendelbach: Dirk Tobben: Kathryn H. Varian; Current Assignee. The listed assignees may be ...
EP A2 - Improved multi-level conductive structure and methods...
patents.google.com
Other languages: German: English: French; Inventor: Dirk Tobben: Peter Weigand; Current Assignee. The listed assignees may be inaccurate. › zh-cn
EP A1 - Selbstjustierte metalldeckschichten für...
patents.google.com
Other languages: English: French; Inventor: Dirk Tobben: Jeffrey Gambino; Current Assignee. The listed assignees may be inaccurate. Other languages: English: French; Inventor: Kathryn H. Varian: Dirk Tobben: Matthew Sendelbach; Current Assignee. The listed assignees may be inaccurate. › patents
Dirk Tobben | Phone, Address, Email and More (1 Record Found)
www.checkpeople.com
Dirk Tobben found in 1 state. View Dirk's current address, phone number, social media profiles (Facebook, Instagram) + background check report. Browse arrest ...
Current Address, Phone Numbers, Age, Date of Birth, Public Records ...
www.fullnamedirectory.com
... Diana Tobben · Diane Tobben · Dirk Tobben · Don Tobben · Donald Tobben · Doris Tobben · Dorothy Tobben · E Tobben · Edward Tobben · Edwardjr Tobben ...
Metallization in semiconductor devices - MyScienceWork
www.mysciencework.com
EP B1 - EPO. Application Mar 17, Publication May 31, Dirk Tobben Bruno Spuler Martin Gutsche Peter Weigand ... Semiconductor fuse EP A2 - EPO. Application May 31, Publication Dec 29, Dirk Tobben Stefan J. Weber Axel Brintzinger ... › ...
US A - Multi-level conductive structure including low...
patents.google.com
A method for forming a multi-level conductive structure on an integrated circuit. The method includes forming a first conductive layer 108 and forming a...
EP A2 - Process for manufacture of trench DRAM capacitor...
patents.google.com
Авторы изобретения, Ulrike Gruening, Carl J. Radens, Dirk Tobben. Заявитель, Infineon Technologies North America Corp., International Business Machines Corporation. Библиографические ссылки, BiBTeX, EndNote, RefMan. Другие патенты (6), Документы, не являющиеся патентами (1), Ссылки ...
EP A3 - Planarization of an interconnection structure...
patents.google.com
A method for planarizing a semiconductor structure
having a first surface region with a high aspect ratio
topography and a second surface region with a...
Patent US 6,271,142 B1 - RPX Insight - RPX Corporation
insight.rpxcorp.com
Assignors: Dirk Tobben, GRUENING, ULRIKE,. No Assignor Available. Assignee: Infineon Technologies AG NORTH TANTAU AVENUE, CUPERTINO, ...
DE D1 - Mikrostruktur und Verfahren zu ihrer Herstellung...
patents.google.com
Opfindere, Dirk Tobben, Peter Weigand. Ansøger, Infineon Technologies Ag. Eksportér citat, BiBTeX, EndNote, RefMan. Klassifikationer (19), Juridiske ...
DE T2 - Selbstjustierte metalldeckschichten für...
patents.google.com
... PCT/US , PCT/US , PCT/US , PCT/US , PCT/US Inventors, Jeffrey Westford GAMBINO, Dirk Tobben.
EP A2 - Metallization in semiconductor devices
patents.google.com
A method for forming a plurality of electrically
conductive wires on a substrate. The method includes
forming a relatively non-planar metal layer over...
EP A2 - Herstellung von Isolationsschicht über...
patents.google.com
Erfinder, Jochen Beitner, Zconimir Gabric, Ulrike Gruening, Gill Lee, Oswald Spindler, Dirk Tobben. Antragsteller, Infineon Technologies North America Corp.
US A - Dual damascene structure Google Patents
patents.google.com
A method for manufacturing a dual damascene structure includes the use of a sacrificial stud and provides an improved defined edge on the interface...
US B1 - Self-aligned metal caps for interlevel metal...
patents.google.com
A method for connecting metal structures with self-aligned metal caps, in accordance with the invention, includes providing a metal structure in a first...
DE D1 - Verfahren zur Herstellung einer Doppel-Damaszener...
patents.google.com
Inventors, Martin Gutsche, Dirk Tobben. Applicant, Infineon Technologies Ag. Export Citation, BiBTeX, EndNote, RefMan. Classifications (7), Legal Events (2) ...
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