Gerhard Fotheringham und Ivan Ndip - Info zur Person

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Advances in Multifunctional Materials and Systems II / Edition 1 by...

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· Alfred Ebberg, Jürgen Meggers, Kai Rathjen, Gerhard Fotheringham, Ivan Ndip, Florian Ohnimus, Christian Tschoban, Isa Pieper, Andreas Kilian ...

Advances in Multifunctional Materials and Systems II - Google Books

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... Jiirgen Meggers, Kai Rathjen, Gerhard Fotheringham, Ivan Ndip, Florian Ohnimus, Christian Tschoban, Isa Pieper, Andreas Kilian, Sebastian Methfessel, ...

Advances in Multifunctional Materials and Systems II von Jun Akedo |...

www.lehmanns.de

... Radio Frequency Range 37 Alfred Ebberg, Jurgen Meggers, Kai Rathjen, Gerhard Fotheringham, Ivan Ndip, Florian Ohnimus, Christian Tschoban, Isa Pieper, ...

Through Silicon Vias For 3d Integration

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... Ing Ivan Ndip Design and Modeling of Through Silicon Vias for 3D Integration Ivan Ndip Brian Curran Gerhard Fotheringham Jurgen Wolf Stephan Guttowski.

Table of Contents | International Journal of Microwave Science...

www.hindawi.com

... Substrates for Compact Wireless Sensor Nodes, Florian Ohnimus, Uwe Maaß, Gerhard Fotheringham, Brian Curran, Ivan Ndip, Thomas Fritzsch, Jürgen Wolf, ...

Design+and+Comparison+of+24+GHz+Patch+Antennas+on+Glass ...www.airitilibrary.com › Publication › alDetailedMesh

www.airitilibrary.com

Florian Ohnimus ； Uwe Maaß ； Gerhard Fotheringham ； Brian Curran ； Ivan Ndip ； Thomas Fritzsch ； Jürgen Wolf ； Stephan Guttowski ； Klaus-Dieter Lang.

Alle Infos zum Namen "Gerhard Fotheringham"

Shop Advances in Multifunctional Materials and Systems II: Ceramic...

www.dicksmith.com.au

... Jurgen Meggers, Kai Rathjen, Gerhard Fotheringham, Ivan Ndip, Florian Ohnimus, Christian Tschoban, Isa Pieper, Andreas Kilian, Sebastian Methfessel, ...

Advances in Multifunctional Materials and Systems II...

www.wildfiretextbooks.com.au

Alfred Ebberg, Jürgen Meggers, Kai Rathjen, Gerhard Fotheringham, Ivan Ndip, Florian Ohnimus, Christian Tschoban, Isa Pieper, Andreas ...

Design and Modeling of Through-Silicon Vias for 3D Integration - PDF...

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Design and Modeling of Through-Silicon Vias for 3D Integration Ivan Ndip, Brian Curran, Gerhard Fotheringham, Jurgen Wolf, Stephan Guttowski, Herbert Reichl ...

SMART SYSTEMS INTEGRATIONS 9 – 10 April 2008, Barcelona ...

www.mesago-online.de

ISBN Minimizing the impact of fabrication tolerance on embedded filters. Gerhard Fotheringham, Uwe Maass, Ivan Ndip, Stephan Guttowski ...

Packaging in the lot Era 16. Packaging for Advanced Microsystems 25docplayer.org › Packaging-in-the-lot-era-16-packaging-for-adv...

docplayer.org

... Xiaomin Duan, Gerhard Fotheringham,, Uwe Maaß, Ivan Ndip, Christian Tschoban Chapter II: Advanced PCB Packaging Das multi-funktionale Board - Heterogene ...

Jahrbuch Oberflachentechnik; Bd.65 (Bad Saulgau, 2009). - ОГЛАВЛЕНИЕ...

www.prometeus.nsc.ru

381 RFID - Theoretische Konzepte und Anwendungsbeispiele Gerhard Fotheringham, Florian Ohnimus, Uwe Maaß, Ivan Ndip, Stephan ...

Verwandte Suchanfragen zu Gerhard Fotheringham

Ivan Ndip
Stephan Guttowski
Sebastian Methfessel

Alfred Ebberg
Florian Ohnimus

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Vorname "Gerhard" (38185)
Name "Fotheringham" (138)

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Gerhard Fotheringham und Ivan Ndip Person-Info