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TUM - Gehäusetechnologien für SAW-Bauelemente, MEMS-Mikrofone und...
portal.mytum.de
Prof. Dr. Gregor Feiertag, Hochschule für Angewandte Wissenschaften, München Oberseminar "Elektrophysik und Physikalische Elektronik" Veranstalter. Lehrstuhl für Technische Elektrophysik Ansprechpartner. Anna-Lena Kersten.tum.de Back to Calendar. iCal ...
Gregor Feiertag | XanEdu Customization Platform
www.academicpub.com
Author: Gregor Feiertag. Results. Flip chip packaging for MEMS microphones Springer Science+Business Media By: Gregor Feiertag ...
A method for improving the drop test performance of a MEMS...
www.deepdyve.com
A method for improving the drop test performance of a MEMS. microphone. Matthias Winter. a*. , Seifeddine Ben Aoun. b. , Gregor Feiertag. c. , Anton Leidl.
Numerical optimization of adhesive mounted MEMS pressure sensors |...
ieee-dataport.org
Andreas Dörfler, Gregor Feiertag, Matthias Schmidt, Andreas Rüdiger, Ulrich Wagner. Our research addresses time-dependent hysteresis effects in adhesive ...
Numerical optimization of adhesive mounted MEMS pressure sensorsieee-dataport.org › documents › numerical-optimiza...
ieee-dataport.org
· Citation Author(s):: Andreas Dörfler, Gregor Feiertag, Matthias Schmidt, Andreas Rüdiger, Ulrich Wagner; Submitted by: Andreas Doerfler ...
Miniaturized electrical component comprising an MEMS and an ...patents.justia.com › patent
patents.justia.com
16 Jun · , September 29, 2011, Feiertag et al Inventors: Gregor Feiertag (Munich), Hans Krueger (Munich), Wolfgang Pahl (Munich), ...
A method for improving the drop test performance of a MEMS microphone...
spie.org
Author(s): Matthias Winter; Seifeddine Ben Aoun; Gregor Feiertag; Anton Leidl; Patrick Scheele; Helmut Seidel
Flip chip packaging for MEMS microphones | SpringerLink
link.springer.com
We have developed a microphone package using flip chip technology instead of chip and wire bonding to create smaller MEMS microphones. With this new packag
Influence of a chip scale package on the frequency response of a MEMS...
link.springer.com
Matthias Winter • Gregor Feiertag •. Anton Leidl • Helmut Seidel. Received: 27 July Accepted: 9 December Published online:
Flip chip packaging for MEMS microphones | SpringerLinklink.springer.com › article
link.springer.com
· Flip chip packaging for MEMS microphones. Gregor Feiertag,; Matthias Winter &; Anton Leidl. Microsystem Technologies volume 16, ...
Gregor Feiertag, Muenchen DE - Patent applications
www.patentsencyclopedia.com
, Method for Producing a MEMS Package - A carrier substrate has a mounting location with a number of electrical connection pads on a top side ...
Flip chip packaging for MEMS microphones | springerprofessional.de
www.springerprofessional.de
We have developed a microphone package using flip chip technology instead of chip and wire bonding to create smaller MEMS microphones. With this new
A Framework for Calibration of Barometric MEMS Pressure Sensors
www.infona.pl
Barometric MEMS pressure sensors must be calibrated at several temperatures and pressures. The fewer calibration points are needed to fulfill a sensor...
Determining The Acoustic Resistance of Small Sound Holes for MEMS...
cyberleninka.org
Abstract Capacitive MEMS microphones are now widely used for mobile phones and headsets. The frequency...
Sensors | Free Full-Text | A Novel Piezoresistive MEMS Pressure...
www.mdpi.com
Reviewer 2: Gregor Feiertag. Reviewer 3: Tran Quang Trung. Sensors 2020, 20(2), 337; https://doi.org s Received: 9 December Revised: ...
Fertigungsendtest für MEMS-Mikrofone - NIwww.ni.com › case-studies › manufacturing-end-test-for-mems-microphones
www.ni.com
"Mikroelektromechanische Systeme werden heutzutage überwiegend als Sensoren in Mobiltelefonen eingesetzt." - Prof. Dr. Gregor Feiertag, Hochschule für ...
Fertigungsendtest für MEMS-Mikrofone - NIwww.ni.com › de-ch › innovations › case-studies › ma...
www.ni.com
Prof. Dr. Gregor Feiertag - Hochschule für Angewandte Wissenschaften München M. Sc. Sebastian Walser - Hochschule für Angewandte Wissenschaften München
Flip chip MEMS microphone package with large CyberLeninkacyberleninka.org › article
cyberleninka.org
Gregor Feiertag, Matthias Winter, Petko Bakardjiev, Elmar SchröderMünchen, Germany b EPCOS AG a group company of TDK-EPC corporation, ...
Microsystem Technologies | springerprofessional.de
www.springerprofessional.de
Flip chip packaging for MEMS microphones. Gregor Feiertag, Matthias Winter, Anton Leidl | Technical Paper | Ausgabe
US A1 - Mems Microphone And Method For Producing The...
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MEMS Microphone And Method For Producing The MEMS Microphone - Patent...
www.patentsencyclopedia.com
Patent applications by Gregor Feiertag, Muenchen DE. Patent applications by Hans Krueger, Muenchen DE. Patent applications by Stefan ...
Miniaturized Electrical Component Comprising an MEMS and an ASIC and...
www.patentsencyclopedia.com
Inventors: Gregor Feiertag (Muenchen, DE) Gregor Feiertag (Muenchen, DE) Hans Krueger (Muenchen, DE) Hans Krueger (Muenchen, DE) ...
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