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Holger Torwesten - Patents
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... disposed on the plurality of conducting lines. The conducting lines include... Inventors: Manfred Schneegans, Holger Torwesten (Infineon Technologies Ag)
Inventors on Infineon Technologies Ag patents (2014)
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Holger Torwesten · Hongfa Luan · Hong-jyh Li · Hongsheng Zhong · Horst Groeninger · Horst Groeninger · Horst Theuss · Hubert Maier · Hubert Rothleitner. › Infin...
Infineon Technologies Ag patent inventors (2013)
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Inventors on Infineon Technologies Ag patents (2013). Google+ Twitter Facebook Reddit Buffer Slashdot ... Holger Busch · Holger Huesken · Holger Torwesten.
Business-Profile
patentbuddy: Holger Torwesten
INFINEON TECHNOLOGIES AG, Neubiberg, DE
Bücher
Holger+Torwesten | XanEdu Customization Platform
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million pieces of educational content – such as case studies and journal articles ...
Evaluation of lead-free SnAg solder ball deposition and reflow ...
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... chip applications | Johann Helneder; Charlotte Hoyler; Manfred Schneegans; Holger Torwesten | download | BookSC. Download books for free. Find books. › book
Suppression of Interdiffusion in Copper/Tin Thin Films | Harald ...
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Harald Etschmaier, Holger Torwesten, Hannes Eder, Peter Hadley. यह पुस्तक आपको कितनी अच्छी लगी? › book
Interconnect Technology for Three-dimensional Chip Integration -...
books.google.de
... Holger Torwesten, Mr. Schäfer and Mirjana Rest Infineon, for providing manufacturing services and support, Sigrid Hill, Dean's Office, Faculty of Engineering ...
Dokumente zum Namen
ABSTRACT Title of Dissertation - UMD DRUM
drum.lib.umd.edu
von M Serebreni · — [9] Helneder, Johann, Charlotte Hoyler, Manfred Schneegans, and Holger Torwesten. "Evaluation of lead-free SnAg solder ball deposition and reflow processes ... › bitstream › handle
Evaluation of lead-free SnAg solder ball deposition and reflow...
dokumen.tips
g fli Ma Otto Available online 24 August Keywords: SnAg electroplating; Flip chip; Reflow; Soldering; Pattern plating; Shear strength; Binary for this...
EBSCOhost | | Suppression of Interdiffusion in Copper/Tin...
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Suppression of Interdiffusion in Copper/Tin Thin Films. Harald Etschmaier, Holger Torwesten, Hannes Eder, and Peter Hadley. (Submitted April 18, 2011).
Wissenschaftliche Veröffentlichungen
Microelectronic Engineering | Proceedings of the ninth european...
www.sciencedirect.com
Original research article: Pages Johann Helneder, Charlotte Hoyler, Manfred Schneegans, Holger Torwesten. Download PDF. Article preview ...
Microjoints and technology for wafer-level vertical chip ...
oparu.uni-ulm.de
von A Munding · · Zitiert von: 12 — Infineon Technologies Corporation, which follows the strategy of chip-to-wafer ... Holger Torwesten, Mr. Schäfer and Mirjana Rest Infineon, ... › handle › vts_6026_8101
パワーデバイスパッケージの実装技術 - J-Stage
www.jstage.jst.go.jp
von 宝藏寺裕之 · · Zitiert von: 2 — [3]Karsten Guth, Dirk Siepe, Jens Görlich, Holger Torwesten,. Roman Roth, Frank Hille, Frank Umbach, “New assembly and. › article › mes › _pdf › -char
Veröffentlichungen allgemein
Le Packaging en électronique de puissance - CORE
core.ac.uk
— [56] Karsten Guth, Dirk Siepe, Jens Görlich, Holger Torwesten, Roman Roth, Frank Hille, and Frank Umbach. New assembly and interconnects ... › download
Suppression of Interdiffusion in Copper/Tin Thin Films | SpringerLink
link.springer.com
Copper/tin thin film couples are often used in microelectronics assembly as device backside coatings for die attach and also as circuit board coatings to m
Artikel & Meinungen
huhu
de.nntp2http.com
Von: Torwesten Holger () [Profil] ... Message-ID: &.infineon.com> Newsgroup: de.test. so ein schöner Tag [ Auf dieses ...
Sonstiges
US B2 - Integrated circuit with capacitor and method for the...
patents.google.com
An integrated circuit and fabrication method are presented. The integrated circuit includes a capacitor containing a base electrode, a covering...
Chip package and method of forming the same - Google Patents
patents.google.com
Inventor: Holger Torwesten: Manfred Mengel: Stefan Schmid: Soon Lock Goh: Swee Kah Lee; Current Assignee ... Application filed by Infineon Technologies AG. › patent
DE A8 - Chipgehäuse und Verfahren zum Bilden desselben...
patents.google.com
Inventors, Swee Kah Lee, Manfred Mengel, Stefan Schmid, Holger Torwesten, Soon Lock Goh. Applicant, Infineon Technologies Ag. Export Citation, BiBTeX ...
Holger Torwesten Bottrop: Kontakte, Telefon, Adresse, Arbeit Holger ...
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Holger Torwesten - Patent applications
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Holger Torwesten. Holger Torwesten, Neubiberg DE. Patent application number, Description ... Holger Torwesten, Regensburg DE. Patent application number ...
EP A1 - Integrierte schaltungsanordnung mit kondensator und...
patents.google.com
Inventors, Thomas Göbel, Johann Helneder, Heinrich KÖRNER, Andrea Mitchell, Markus Schwerd, Martin Seck, Holger Torwesten. Applicant ...
芯片封装和制造芯片封装的方法 - SooPAT专利搜索
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... INFINEON TECHNOLOGIES AG. 地址： 德国瑙伊比贝尔格市********(隐藏). 发明(设计)人： M.门格尔 H.托维斯滕. Inventor： MANFRED MENGEL; HOLGER TORWESTEN.
ALBERT — All Library Books, journals and Electronic Records...
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ALBERT - All Library Books, journals and Electronic Records Telegrafenberg
New assembly and interconnects beyond sintering methods - PDF Free...
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... Dirk Siepe 1, Jens Görlich 1, Holger Torwesten 2, Roman Roth 2, Frank Hille 3, Frank Umbach Infineon Technologies AG, Max-Planck-Straße.
INTEGRATED CIRCUIT WITH CAPACITOR AND METHOD FOR ...
www.patentsencyclopedia.com
... Helneder Heinrich Korner Andrea Mitchell Holger Torwesten Agents: BRINKS HOFER GILSON & LIONE/INFINEON;INFINEON Assignees: Infineon Technologies AG › ...
Evaluation of lead-free SnAg solder ball deposition and reflow...
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... SnAg solder ball deposition and reflow processes for flip chip applications. Johann Helneder, Charlotte Hoyler, Manfred Schneegans, Holger Torwesten.
International Exhibition and Conference for Power Electronics,...
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5 New Assembly and Interconnects Beyond Sintering Methods Karsten Guth, Dirk Siepe, Jens Görlich, Holger Torwesten, Roman Roth, Frank Hille, Frank ...
Firmen aus Deutschland: Bauholz und Holzprodukte, außer Möbeln •...
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Industrie-Business-Katalog Unternehmen, Firmen und Organisationen in Deutschland. Sektor - Bauholz und Holzprodukte, außer Möbeln. Industrial business catalog...
New assembly and interconnects beyond sintering methods
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... author={Karsten Guth and Dirk H. Siepe and Jens G{\"o}rlich and Holger Torwesten and Roman Roth and Frank Hille and Frank Umbach}, year={2010} }. › ...
People with TORWESTEN in surname or second name
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Holger Torwesten, Regensburg Germ... Ilse Torwesten, Ü Berlauterecken 11 Lauterecke... Ingrid Torwesten, Regensburg German. › T › TOR
Suppression of Interdiffusion in Copper/Tin Thin Films
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von H Etschmaier · · Zitiert von: 11 — Suppression of Interdiffusion in Copper/Tin Thin Films. Harald Etschmaier, Holger Torwesten, Hannes Eder, Peter Hadley. › sup...
Suppression of Interdiffusion in Copper/Tin Thin Films - [scite report]
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Mentioning: 6 - Suppression of Interdiffusion in Copper/Tin Thin Films - Harald Etschmaier, Holger Torwesten, Hannes Eder, Peter Hadley. › reports
Electronic Device - Patent application
www.patentsencyclopedia.com
Patent application title: Electronic Device. Inventors: Holger Torwesten Manfred Schneegans Agents: DICKE, BILLIG & CZAJA Assignees: ...
J. Gindal N\A: Kontakte, Telefon, Adresse, Arbeit J. Gindal,...
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Unternehmensdaten J. Gindal N\A sind Details, Adresse, Telefonnummer, Kontakte, Kommentare, offene Stellen. Ein ausführlicher Bericht über die Arbeit des...
Verwandte Suchanfragen zu Holger Torwesten
| Peter Hadley Johann Helneder Jens Görlich | Dirk Siepe Karsten Guth Frank Hille | Hannes Eder Eva Torwesten Bodo Torwesten |
Personen Vorname "Holger" (27292) Name "Torwesten" (36) |
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