News
Laci Andricek for the DEPFET Collaboration (www.depfet.org)
indico.mpp.mpg.de
HLL Project Review, April Ladislav Andricek, MPI für Physik, HLL A new r/o chip - DCD1 (Ivan Peric/Peter Fischer) DCD: Drain Current Digitizer what is new?-: improved input cascode (regulated) and current memory cells-: designed for 40 pF load at the input (1st layer ILC VTX)-: f/e noise: 34nA@40pF, 17nA@10pF, add 37nA for memory cellsÆ
MPG Halbleiterlabor - Indico
indico.cern.ch
Contact: Ladislav Andricek . Tel: + de . Group Members: Ladislav Andricek, Jelena Ninkovic, Rainer Richter, and technical staff . Current Research Activities: Development, design and production of silicon detectors for ionizing radiation. Current projects in the
Bumping at PacTech - UBM - MPP Indico
indico.mpp.mpg.de
Ladislav Andricek, MPG Semiconductor Lab. 6 June 2014: 20 hot SWB + 10 setup dummies sent to PacTech. :- received warnings because of scratches and ... Ladislav Andricek, MPG Semiconductor Lab. Participants: Juan, Carlos L., Marcel, Miguel, Nacho (IFIC). Gianni, Jose… (NTC). Christian, Hans-Guenther (MPP). › summary › Laci-evo
Interconnections the link between sensors and r/o electronics
agenda.infn.it
flip chip / bump bonding. -: 3D integration approach. Sensors made in. CMOS Fabs. ANSIP2011, Acireale, Nov Ladislav Andricek, MPI für Physik, HLL ... › ANSIP-Laci
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