Matthias Kraatz und Ehrenfried Zschech - Info zur Person

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BibTeX - OPUS 4

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@misc{ZschechHoSchmeisseretal.2011, author = {Ehrenfried Zschech and O. S. Ho and Dieter Schmei{\"s}er and Moritz Andreas Meyer and A. V. Vairagar and G. Schneider and M. Hauschildt and Matthias Kraatz and V. Sukharev}, title = {Geometry and Microstructure Effect on EM-Induced Copper Interconnect ...

Materials & DesignSquarespace

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von K Kutukova · · Zitiert von: 5 — Kristina Kutukova a, JЭrgen Gluch b,1, Matthias Kraatz b, AndrИ Clausner b, Ehrenfried Zschech a,* a deepXscan GmbH

In-situ X-ray tomographic imaging and controlled steering ...ScienceDirect

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von K Kutukova · · Zitiert von: 5 — ... overlay panel. Kristina Kutukova a , Jürgen Gluch b 1 , Matthias Kraatz b , André Clausner b , Ehrenfried Zschech a. Show more. Add to Mendeley. Share.

IRPS 2021: Monterey, CA, USA - DBLPdblp.org › Conferences and Workshops › IRPS

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Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner , Ehrenfried Zschech, Martin Gall: Strategy to Characterize Electromigration ...

Verhandlungen der Deutschen Physikalischen Gesellschaft

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11:30, DS 13.4, Electromigration simulation for on-chip Cu interconnects — •Matthias Kraatz, Dieter Schmeisser, Ehrenfried Zschech, and Paul S. Ho. 11:45, DS ...

Grain Size And Cap Layer Effects On Electromigration Reliability Of...

repositories.lib.utexas.edu

Lijuan Zhang, Matthias Kraatz, Oliver Aubel, Christian Hennesthal, Ehrenfried Zschech, and Paul S. Ho. AIP Conference Proceedings 1300, 3 (Dec., 2010); doi: ...

Scaling effects on microstructure and reliability for cu interconnectsopus4.kobv.de › opus4-UBICO › frontdoor › index › index › docId

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von PS Ho · · Zitiert von: 6 — Paul S. Ho, Ehrenfried Zschech, Dieter SchmeißerORCiD, Moritz Andreas Meyer, Rene Huebner, Meike Hauschildt, Lijuan Zhang, Martin Gall, Matthias Kraatz.