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Panel Level Packaging Consortium Takes Up Its WorkAT&S
ats.net
Michael Töpper, co-coordinator at the Fraunhofer IZM, recalls: “We called Asia in the morning, our European partners during the day, and spent the evenings ...
Erstes Jahr Panel Level Packaging Konsortium (PLC) 2.0 – Innovations...
www.innovations-report.de
— Michael Töpper l Telefon + l .de | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration ... › fachgebiete › erstes...
From Wafer to Panel Level Packaging - Fraunhofer IZM
www.izm.fraunhofer.de
29. Okt · The focus of his work was Wafer Level Packaging applications with a focus on materials. Since he is part of the business development team at Fraunhofer IZM. Michael Töpper is Senior Member of IEEE-CPMT and has received the European Semi-Award in for WLP. He has published several book chapters and is author and co-author of ...
IEEE Awards for four Fraunhofer IZM scientists - Fraunhofer IZM
www.izm.fraunhofer.de
Web5 de dic. de · Michael Töpper is the current Chair of the IEEE Technical Committee of Wafer Level Packaging. His Fraunhofer IZM research group investigates and develops …
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