Moritz Andreas Meyer und Ehrenfried Zschech - Info zur Person

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In situ observation of electromigration-induced void migrationcdu.edu.ua

eprints.cdu.edu.ua

von AV Vairagara · · Zitiert von: 121 — A. M. Gusak,b) Moritz Andreas Meyer, and Ehrenfried Zschech. AMD Saxony LLC & Co. KG, Dresden, Germany. (Received 3 February 2004; accepted 27 July 2004).

New Microstructure-Related EM Degradation and Failure ...American Institute of Physics

pubs.aip.org

von MA Meyer · · Zitiert von: 13 — Moritz Andreas Meyer , Ehrenfried Zschech. AMD Saxony LLC & Co KG, Wilschdorfer , D Dresden, Germany.

Study of electromigration-induced voiding mechanisms in CU ...Nanyang Technological University

dr.ntu.edu.sg

grateful to Ehrenfried Zschech and Moritz Andreas Meyer for providing an opportunity to work on the in-situ SEM system and support at Advanced Micro Devices ...

Alle Infos zum Namen "Moritz Andreas Meyer"

Hans-Juergen Engelmann | Globalfoundires - Academia.eduAcademia.edu

globalfoundries.academia.edu

... ANALYSIS FOR SUB-100NM CU/LOW-K STRUCTURES Ehrenfried Zschech, Rene Huebner, Pavel Potapov, Inka Zienert, Moritz Andreas Meyer, Dmytro Chumakov .

In situ SEM observation of electromigrationPractical Electron Microscopy and Database

www.globalsino.com

[1] A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy, K. N. Tu, A. M. Gusak, Moritz Andreas Meyer, and Ehrenfried Zschech, In situ observation of ...

In situ observation of electromigration-induced void ...nycu.edu.tw

scholar.nycu.edu.tw

A. V. Vairagar*, S. G. Mhaisalkar, Ahila Krishnamoorthy, King-Ning Tu, A. M. Gusak, Moritz Andreas Meyer, Ehrenfried Zschech. *此作品的通信作者.

In situ observation of electromigration-induced void migration in dual ...City University of Hong Kong

scholars.cityu.edu.hk

Author(s) · A. V. Vairagar · S. G. Mhaisalkar · Ahila Krishnamoorthy · A. M. Gusak · Moritz Andreas Meyer · Ehrenfried Zschech ...

M. Grafe's research works | Technische Universität ...ResearchGate

www.researchgate.net

Ehrenfried Zschech; Moritz Andreas Meyer · Marco Grafe · Gerd Schneider. In-situ SEM and XRM studies of fully embedded via/line interconnect structures ...

Welcome to Electronic Thin Film Lab at UCLA!UCLA

www.seas.ucla.edu

32, (2003 October); A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy, K.N. Tu, A.M. Gusak, Moritz Andreas Meyer, Ehrenfried Zschech, ...

Characterization and metrology for ULSI technology :

catalog.princeton.edu

... Hartmut Prinz, Moritz-Andreas Meyer and Ehrenfried Zschech -- In situ X-ray Microscopy Studies of Electromigration in Copper Interconnects / G. Schneider, ...

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