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Robert Hammedinger - Patents

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Recent bibliographic sampling of Robert Hammedinger patents listed/published in the public domain by the USPTO (USPTO Patent Application #,Title): ...

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US A - Component substrate and method for holding a component...

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This invention is for holding components made of a ferromagnetic material parallel to a component axis for electroplating the component. The component...

US B2 - Semiconductor device and method of manufacturing the...

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When manufacturing a semiconductor device by mounting a semiconductor chip 2 on a substrate 1 with a flip-chip method, projections 9 are formed...

US A1 - Soldering method, gyroscope and soldered part...

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The invention relates to a method of soldering a conducting body to a substrate using an alloy chosen from either a tin-silver alloy or a...

WELDABLE CONTACT AND METHOD FOR THE PRODUCTION THEREOF - Patent...

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Patent application title: WELDABLE CONTACT AND METHOD FOR THE PRODUCTION THEREOF. Inventors: Robert Hammedinger (Poing, ...

DE B3 - Flip-Chip-Bauelement und Verfahren zur Herstellung...

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Die Erfindung betrifft ein Bauelement, einen in Flip-Chip-Technik auf ein Trägersubstrat aufgebrachten Bauelementchip und ein Verfahren zur Herstellung.Die...

US A1 - Semiconductor device with under bump metallurgy and...

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US A1 * Robert Hammedinger Weldable contact and method for the production thereof. US A1 *

WO A1 - Weldable contact and method for the production...

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The invention relates to a weldable contact for an electrical component, comprising a pad metallisation and a UBM metallisation applied on top of the...

US A1 - Weldable contact and method for the production...

patents.google.com

A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part...

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