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Sensors (Basel, Switzerland) | Scholars Portal Journalsjournals.scholarsportal.info › browse
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Stephan Schmiel · Christine Harendt · André Zimmermann. Source Information. June 2017, Volume17(Issue7). Abstract. Packaging represents an important part in the ...
CMOS Readout Chips for Implantable Multimodal Smart Biosensorsgoogle.ca
books.google.ca
... Stephan Schmiel for bonding the chips and preparing the glob-top samples and for Gunter Feucht for performing the on-wafer measurements. I am very thankful ...
Ultra-Thin Sensors and Data Conversion Techniques for Hybrid ...google.ca
books.google.ca
... Stephan Schmiel and Mr. Dennis Kühnle for their support during chip assembly and wire-bonding. I would also like to extend my acknowledgement to the project ...
CMOS Readout Chips for Implantable Multimodal Smart Biosensorsgoogle.com.br
books.google.com.br
Many thanks go to Stephan Schmiel for bonding the chips and preparing the glob-top samples and for Gunter Feucht for performing the on-wafer measurements.
Ultra-Thin Sensors and Data Conversion Techniques for Hybrid ...google.com.br
books.google.com.br
I owe my profound gratitude to Mr. Stephan Schmiel and Mr. Dennis Kühnle for their support during chip assembly and wire-bonding.
Flexible Packaging by Film-Assisted Molding ...Ingenta Connect
www.ingentaconnect.com
... Stephan Schmiel ; Christine Harendt ; André Zimmermann ;. Source: Sensors, Volume 17, Number 7, 2017, pp (1). Publisher: Directory of Open Stephan Schmiel ; Christine Harendt ; André Zimmermann ;. Source: Sensors, Volume 17, Number 7, 2017, pp (1). Publisher: Directory of Open ...
Ultra-Thin Sensors and Data ConversionSpringer
link.springer.com
-Ing. Golzar Alavi, for their valuable support during the development of HySiF. I owe my profound gratitude to Mr. Stephan Schmiel and Mr. Dennis. Kühnle for Ing. Golzar Alavi, for their valuable support during the development of HySiF. I owe my profound gratitude to Mr. Stephan Schmiel and Mr. Dennis. Kühnle for ...
(PDF) Flexible Packaging by Film-Assisted Molding forAmanote Research
research.amanote.com
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors by Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors by Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel,
[PDF] Flexible Packaging by Film-Assisted Molding for ...Semantic Scholar
www.semanticscholar.org
... Stephan Schmiel and Christine Harendt and Andr{\'e} Zimmermann}, journal={Sensors (Basel, Switzerland)}, year={2017}, volume={17}, url={https://api Stephan Schmiel and Christine Harendt and Andr{\'e} Zimmermann}, journal={Sensors (Basel, Switzerland)}, year={2017}, volume={17}, url={https://api ...
MEMS and Nano-Sensors - Special IssueMDPI
www2.mdpi.com
by Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt and André Zimmermann. Sensors 2017, 17(7), 1511; https://doi.org by Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt and André Zimmermann. Sensors 2017, 17(7), 1511; https://doi.org
Flexible Packaging by Film Assisted Molding for DOCKSCI.COMdocksci.com › ...
docksci.com
... of Inertia Sensors Daniel Hera 1, *, Armin Berndt 2 , Thomas Günther 1 , Stephan Schmiel 2 , Christine Harendt 2 and André Zimmermann 1,
Sensors | Free Full-Text | Flexible Packaging by Film-Assisted...
www.mdpi.com
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. by Daniel Hera 1,*, Armin Berndt 2, Thomas Günther 1, Stephan Schmiel 2, ...
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