Sven Rzepka und Bernd Michel - Info zur Person

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ESREF Oral Presentations Wed

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Dietmar Vogel 1, Ellen Auerswald 1, Juergen Auersperg 1, Parisa Bayat 2, Raul Rodriguez 2, Dietrich Zahn 2, Sven Rzepka 1, Bernd Michel 1 1 Fraunhofer ENAS, Germany; 2 Technical University Chemnitz, Germany Reliability & Failure Mechanisms in Packages and Assembly Wed-C-13:30-Invited Reliability of Wafer Level Chip Scale Packages ...

Advanced Microsystems for Automotive Applications 2012: Smart Systems...

books.google.de

Alexander Otto, Sven Rzepka, Bernd Michel Fraunhofer Institute for Electronic Nano Systems ENAS Department Micro Materials Center Technologie-Campus Chemnitz Germany ...

Reliability investigations for high temperature interconnects:...

www.ingentaconnect.com

Sven Rzepka and Bernd Michel. Micro Materials Center, Fraunhofer ENAS, Chemnitz, Germany. Abstract. Purpose – Because of the need for electronics use at ...

Raul Mrossko - dblp

dblp.uni-trier.de

— F. Schindler-Saefkow, F. Rost, A. Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, J. Keller: › Persons › Raul Mrossko

UBICO : Fachgebiet Elektronische Schaltungstechnik

www.b-tu.de

Publikationen. Artikel in Fachzeitschriften Ralph Schacht, Sven Rzepka, Bernd Michel, Parametric Transient Thermo-Electrical PSPICE-Model for a Power Cable, ...

: free download. Ebooks library. Online books store on Z-Libraryb-ok.as › ...

b-ok.as

Alexander Otto, Sven Rzepka, Thomas Mager, Bernd Michel, Claudio Lanciotti (auth.), Gereon Meyer (eds.) Year: Language: english. File: PDF, MB.

Efficiency optimization for a frictionless air flow blade fan - Opus4opus4.kobv.de › frontdoor › index › index › docId

opus4.kobv.de

Ralph Schacht, Alexander Hausdorf, Bernhard Wunderle, Sven Rzepka, Bernd Michel. This paper resumes the frictionless fan concept which was introduced at ...

Reliability investigations for high temperature interconnects

www.emerald.com

von R Dudek · · Zitiert von: 12 — Sven Rzepka and Bernd Michel. Micro Materials Center, Fraunhofer ENAS, Chemnitz, Germany. Abstract. Purpose – Because of the need for electronics use at ... › content › doi › full › pdf

FEA to Tackle Damage and Cracking Risks in BEoL Structures ...monarch.qucosa.de › qucosa:20518

monarch.qucosa.de

AutorIn: Jürgen Auersperg: D. Breuer: K.V. Machani: Sven Rzepka: Bernd Michel; Titel: FEA to Tackle Damage and Cracking Risks in BEoL Structures under ...

Microsystem Technologies | springerprofessional.dewww.springerprofessional.de › microsystem-technol...

www.springerprofessional.de

John Brueckner, Alfons Dehé, Ellen Auerswald, Rainer Dudek, Dietmar Vogel, Bernd Michel, Sven Rzepka | Technical Paper ...

Reliability investigations for high temperature interconnects |...

www.emerald.com

Reliability investigations for high temperature interconnects - Author: Rainer Dudek, Peter Sommer, Andreas Fix, Joerg Trodler, Sven Rzepka, Bernd Michel

Design for reliability of BEoL and 3-D TSV structures – A joint effort ...aip.scitation.org › doi › abs

aip.scitation.org

· Jürgen Auersperg, Dietmar Vogel, Ellen Auerswald, Sven Rzepka, and Bernd Michel. more...View Affiliations. Fraunhofer ENAS, Micro Materials ...

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Sven Rzepka und Bernd Michel Person-Info