Thomas Koschmieder und Solder - Info zur Person

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Thermal Cycling Analysis of BGA Solder Joint Reliability

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— Brett Wilkerson. This person is not on ResearchGate, or hasn't claimed this research yet. Thomas Koschmieder · Thomas Koschmieder. ›

Alle Infos zum Namen "Thomas Koschmieder"

2004 Ceramic Interconnect Technology Conference

lib3.dss.go.th

Linda M. Bal, Andrew Mawer, Thomas Koschmieder,. Motorola MICROSYSTEM INTtegration witii New Techniques IN. LTCC. ACTIVE SOLDER JOINING FOR LOW ... › fulltext › c_book

BGA underfillsSemiconductor Digest

sst.semiconductor-digest.com

BGA underfills. Increasing board-level solder joint reliability. BY ZANE JOHNSON AND THOMAS KOSCHMIEDER ... Zane Johnson, senior staff engineer, and Thomas ...

Solder Shape Prediction and Residual Stress Evaluation of ...

oa.mg

Betty H. Yeung, Torsten Hauck, Brett P. Wilkerson, Thomas Koschmieder. Soldering. Ball grid array. Temperature cycling. › work › jiep

SOLDER-JOINT RELIABILITY OF 0.8MM BGA PACKAGES ...Circuit Insight

www.circuitinsight.com

von B Carpenter · Zitiert von: 6 — Thomas Koschmieder. Cirrus Logic, Inc. Austin, TX, USA. . ABSTRACT. Described is experimental work to improve solder-joint.

Solder Paste Stencil Design for Optimal QFN Yield and Reliability

shows.iconnect007.com

[11] Pamela O'Brien, Thomas Koschmieder, “Quad Flat Pack No Lead (QFN) Board Level Reliability Study for Automotive Applications”, SMTA International, [12] Dong Hyun Kim, Mudasir Ahmad, Sue Teng, “Reliability Study and AF Modeling for SnAgCu Solder Joints and SnPb Solder Joints in QFN Packages”, SMTA ...