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MicroTech – Advanced Packaging & Technology Trends – iMAPS-UK –...
www.imaps.org.uk
Mobile Devices, Thomas Oppert. 15:20, Mid-Afternoon Break: Coffee, Tea &
Refreshments, Exhibition & Networking. 15:50, Session Four: Materials,
Processes & Devices Sencio: nCapsulate - An Extra Dimension to ...
Untitled Document
ewh.ieee.org
Packaging of Optoelectronic and MEMS Devices with Fluxless Laser Solder Ball Jetting, Thomas Oppert, PacTech GmbH, Germany. Application of AuSn Solder for the
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