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ICSJ2014
www.ieee-csj.org
... Nasu, Taiji Sakai, Brett Sawyer, Hao Lu, Yutaka Takagi, Ryuta Furuya, Yuya Suzuki, Makoto Kobayashi, Vanessa Smet, Venky Sundaram, and Rao Tummala.
Netzwerk-Profile
LinkedIn: venky sundaram - Regional Manager - BrandPier | LinkedIn
Hyderabad Area, India - BrandPier#####View venky sundaram's profile on LinkedIn, the world's largest professional community. venky has 1 job listed on their profile. See the complete profile on ...
Interessen
USHIO Installed a Projection Aligner to Develop 2.5 Glass Interposers...
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USHIO installed a projection aligner based on its latest stepper model
Private Homepages
About - Venky's Blog
venkysundaram.wordpress.com
Hi I am Venky Sundaram a CRM consultant and have a good in-depth knowledge of CRM, ERP and Java tecnologies. I have a vast exposure on Siebel Enterprise CRM ... › ...
Ausbildung
IEICE Trans - Cost-Effective RF Front-End Module Using High Q Passive...
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Stephane PINEL · Mekita F. DAVIS · Venky SUNDARAM · Kyutae LIM · Joy LASKAR · George WHITE · Rao R. TUMMALA Publication
Bücher
bokus.com: Handbook of 3D Integration, Volume 3 - Philip Garrou, Mitsumasa...
Köp Handbook of 3D Integration, Volume 3 av Philip Garrou, Mitsumasa Koyanagi, Peter Ramm. Skickas inom vardagar. Fri frakt över 199 kr. Välkommen till...
Handbook of 3D Integration, Volume 3: 3D Process Technology - Google...
books.google.de
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate...
3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...
books.google.de
11 P. Markondeya Raj, Saumya Gandhi, Srikrishna Sitaraman, Venky Sundaram, and Rao Tummala, “3D IPAC: a new concept in integrated passive and active ...
高密度封装基板 - 田民波 - Google Books
books.google.de
本书从印制线路板和微电子封装的基本概念入手,针对高密度多层基板,详细讨论了制作工艺、相关材料及应用等各个方面的内容。
Dokumente zum Namen
Chip-Scale-Review_Sept-Oct_interactive
www.slideshare.net
11Chip Scale Review September • October • [ChipScaleReview.com] CONTENTS September • October Volume 19, Number 5 ChipScaleReviewSeptember•October2015…
Sundaram, Venky [WorldCat Identities]
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Most widely held works by Venky Sundaram. Introduction to system-on-package (SOP) : miniaturization of the entire system by Rao R Tummala( ) › identities
Polymers for RF Apps - [PDF Document]
vdocuments.site
62 December Madhavan Swaminathan, Venky Sundaram, John Papapolymerou, and P. Markondeya Raj Digital Object Identifier MMM Madhavan ...
(PDF) Chip-Last Embedded Actives and Passives in Thin Organic Package...
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Chip-Last Embedded Actives and Passives in Thin Organic Package for GHz Multi-Band Applications Fuhan Liu, Venky Sundaram, Sunghwan Min, Vivek...
Veröffentlichungen allgemein
Fundamental Limits of Organic Packages and Boards and the Need for...
link.springer.com
SOUNAK BANERJI,1 FUHAN LIU,1 SWAPAN BHATTACHARYA,1 VENKY SUNDARAM,1. KEN-ICHI SHINOTANI3 & GEORGE WHITE1. 1Packaging Research ...
International Journal of Numerical Methods for Heat & Fluid Flow:...
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International Journal of Numerical Methods for Heat & Fluid Flow - Volume 26 Issue 3/4
Fundamental Limits of Organic Packages and Boards and the ...
link.springer.com
von RR Tummala · · Zitiert von: 30 — Rao R. Tummala, P. Markondeya Raj, Shubhra Bansal, Sounak Banerji, Fuhan Liu, Swapan Bhattacharya, Venky Sundaram & George White. › article
TECHNICAL ABSTRACTSwww.qgdigitalpublishing.com/.../article.html
www.qgdigitalpublishing.com
... in Organic Package Substrates” Authors: Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram and Rao Tummala; .
Artikel & Meinungen
3D Thursday: A quick look at glass interposers for 3D IC assembly |...
eda360insider.wordpress.com
3D InCites just published a short piece on glass interposers for 3D ICs, as discussed at the IMAPS International Device Packaging conference, held March...
Story of a name | Naga Chokkanathan
nagachokkanathan.wordpress.com
Links. Venky Sundaram · என். சொக்கன் (My Tamil Blog). Blogroll. http://www.indiaeveryday.in/ · Mango Salute · Create a free website ...
Sonstiges
Venky Sundaram - Program Manager - Strategic Accounts - SAP ...
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View Venky Sundaram's profile on LinkedIn, the world's largest professional community. Venky has 6 jobs listed on their profile. See the complete profile on ...
Venky Sundaram | LinkedIn
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This paper presents the modeling, design and demonstration of a three-dimensional polymer waveguide (3D WG) that couples two optical through-package vias ...
Venky Sundaram | Professional Profile - LinkedIn
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View Venky Sundaram's profile on LinkedIn, the world's largest professional community. Venky has 1 job listed on their profile. See the complete profile on LinkedIn and discover Venky's connections and jobs at similar companies.
Venky Sundaram | LinkedIn
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View Venky Sundaram's professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Venky Sundaram discover ...
Es fehlt: tosa
Dr. Youngwoo Kim, NAIST - International Conferences
sites.google.com
Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala and Joungho Kim, "Analysis of Power Distribution Network in Glass, Silicon Interposer and ... › view › in...
VENKY SUNDARAM's Profile - IIFT Alumni Network
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The Official Alumni Network of Indian Institute of Foreign Trade. Connect with classmates, post jobs, share memories and a lot more.
Venky Sundaram (venkymscmtech) auf Pinterest
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See what Venky Sundaram (venkymscmtech) has discovered on Pinterest, the world's biggest collection of ideas.
Conductive Anodic Filament Failures in Fine-Pitch Through-Via...
www.chemeurope.com
Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates Fuhan Liu, P. Markondeya Raj, Venky Sundaram, ...
Journal of Materials Science: Materials in Electronics
www.springerprofessional.de
Koushik Ramachandran, W. Jud Ready, P. Markondeya Raj, Venky Sundaram, Rao Tummala | Ausgabe Ferroelectric and piezoelectric behavior of (111)-oriented Pb(ZrxTi1−x)O3 thin films on cobalt ferrite nano-seed layered Pt(111)/Si substrate
3D Integration and Characterization Of High Q Passives On ...
attila.sdsu.edu
... Polymer (M-LCP) Based Substrate (Wansuk Yun, Amit Bavisi, Venky Sundaram, Madhavan Swaminathan, Ege Engin), In Asia Pacific Microwave Conference, › bibtexbrowser
Awards and Recognitions - Packaging Lab
packaging.fiu.edu
... Best Poster Award, IEEE Electronic Components and Technology Conference, 2011, H. Sharma, K. Sethi, M. Raj, Venky Sundaram, and Rao Tummala, ... › awards-...
Search: Beiu
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TSV Fabrication and Reliability Analysis (June 2011) Xi Li Qi Ch V k S d R R T l Xi Liu, Qiao Chen, Venky Sundaram, Rao R. Tummala, and Suresh K. › search › mlt
Anubhava 17
www.sastra.edu
Flagship technical fest, conducted jointly by IEEE SASTRA SB and Team ASCIEE
Design and Demonstration of Glass Panel Embedding for 3D ...
meridian.allenpress.com
von S Ravichandran · · Zitiert von: 13 — Venky Sundaram;. Venky Sundaram 1. Search for other works by this author on: This Site · PubMed · Google Scholar. Rao Tummala. Rao Tummala 1. › ar...
Committee Members - Nano Technical Committee
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. Eric Perfecto .com. Swapan Bhattacharya .edu. Venky Sundaram
Institute of Electrical and Electronics Engineers (IEEE) - SMTnet
smtnet.com
Aug 22, | Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Urmi Ray, Venky Sundaram, Raj Pulugurtha, Vanessa Smet, Rao Tummala. › company
Multi-scale thermal modeling of glass interposer for mobile...
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Citation: Sangbeom Cho, Venky Sundaram, Rao Tummala, Yogendra Joshi, ( 2016) "Multi-scale thermal modeling of glass interposer for mobile electronics ...
Electroanalytical Study of Organic Additive Interactions in ...www.springerprofessional.de/electroanalytical-study-of
www.springerprofessional.de
Autoren: Timothy B. Huang, Himani Sharma, Rahul Manepalli, Sashi Kandanur, Venky Sundaram, Rao R. Tummala. » Jetzt Zugang zum ...
IEEE Consultants Network of San Diego
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Ravi Doraiswami, Sandeep Sankararaman, Piyush Gupta, Woopoung Kim, Raghav, Madhavan, Zhuqing Zhang, Lianhua Fan, Venky Sundaram, Fuhan Liu, Seyed Hosseini, Madhavan Swaminathan, C.P.Wong, Rao R. Tummala, Optimization of 100 Micron Pitch Lead Free Solder Assembly Process for High Reliability at ...
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