Wire Bonder und Model - Info zur Person

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Alle Infos zum Namen "Wire Bonder"

Fully automatic wire bonder SALE | Randy Yousey | Pulse | LinkedIn

www.linkedin.com

Taking offers at or letters of interest at , located in NJ. ASM model # AB339, fully automatic wire bonder, 240 v input. Mfg has magazine feed for bandaler strips, but I believe a simple stage can be placed on machine to manually load, and wire bond a complex, fine pitch 40um(?), ...

West Bond 7476E Wedge-Wedge gold wire bonder - Nanotechnology Core...

sites.google.com

The Nanotechnology Core Facility (NCF) is proud to announce the acquisition of a new wire bonder to replace the old gold ball wire bonder. A new West Bond Model 7476E Wedge-Wedge Wire Bonder has been added to our tool set. This tool does not use a capillary, so wire jamming is eliminated.

7400A Wire Bonder - Packaging Equipment - FACILITIES - NDNF -...

www3.nd.edu

Description. The Model 7400A is an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads toe semiconductor, hybrid or ...

Kulicke and soffa Model universal wire bonder |...

uwaterloo.ca

The Kulicke and soffa wire bonder uses heat and ultrasonic ('thermosonic') energy to stitch connecting wires between suitable bond points on semiconductor circuits or between bond points and external contacts such as package leads. Features:

KNS 4523A Digital Wire Bonder | National Nanotechnology...

www.nnin.org

KNS 4523A Digital Wire Bonder. Site: Ge… Institute of Technology. Tool ID: GT Tool Model: 4523A Digital. Tool Manufacturer: K&S. Tool Area:.

Kulicke and Soffa Model Wedge Wire Bonder | NIST

www.nist.gov

› laboratories

Wedge Wire Bonder - Westbond 7476E | Centre for Research in Photonics...

photonics.uottawa.ca

The Westbond wedge wire bonder 7476E Model is designed to interconnect wire leads between contact pads and semiconductor, hybrid, microwave or MEMS ...

Facilities : Integrated Nanosystems Center : University of Rochester

www.rochester.edu

Wire Bonder. Wire Bonder. Model: K&S Wire Bonder. Capabilities: This tool is capable of bonding small wires to contact pads using a combination of ultrasonics and heating. Cost: For UR users · For nonUR users. STATUS: Working. Calendar for Reservations: Click here. Specifications: Al wire. ball and wedge bonding ...

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