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Variobond.de - Erfahrungen und Bewertungen
www.webwiki.de
Finden Sie Bewertungen und Erfahrungen zu Variobond.de. Semiautomatic Wedge and Balll Bonder. Reflow, Solder, Oven, Rapid und Thermal. Klicken Sie hier für...
West Bond 7476E Wedge-Wedge Wire Bonder | Stanford Nano Shared...
snsf.stanford.edu
The West Bond 7476E Wedge-Wedge Wire Bonder features programmable dual force (high or low), pure vertical Z, pneumatic braking of all axes during ...
WESTBOND E WIRE BONDER — Columbia Nano Initiative
cni.columbia.edu
Manual gold wire bonder (wedge-wedge and ball-wedge), ultrasonic wedge, 45° Feed with a ” gold wire (range from " to "). The bonder is ...
Platinum wire wedge bonding: A new IC and microsensor interconnect |...
link.springer.com
Interconnects are made by using a conventional wire bonder to ultrasonically wedge bond mm diameter Pt wires to both Pt and Al thin films. Interconnects made in this manner are remarkably strong, as compared with Au wire bonds, with pull strengths of ∼13 g. Electrical measurements show contact ...
Wire bonding – LNF Wiki
lnf-wiki.eecs.umich.edu
The K&S Wire Bonder is a wedge bonder that is designed to connect bond pads on devices to the leads of a package such as DIP or TO-5 cases.
West Bond 7476E Wedge-Wedge gold wire bonder - Nanotechnology Core...
sites.google.com
The Nanotechnology Core Facility (NCF) is proud to announce the acquisition of a new wire bonder to replace the old gold ball wire bonder. A new West Bond Model 7476E Wedge-Wedge Wire Bonder has been added to our tool set. This tool does not use a capillary, so wire jamming is eliminated.
7400A Wire Bonder - Packaging Equipment - FACILITIES - NDNF -...
www3.nd.edu
Description. The Model 7400A is an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads toe semiconductor, hybrid or ...
Wedge Wire Bonder - Westbond 7476E | Centre for Research in Photonics...
photonics.uottawa.ca
The Westbond wedge wire bonder 7476E Model is designed to interconnect wire leads between contact pads and semiconductor, hybrid, microwave or MEMS ...
Facilities : Integrated Nanosystems Center : University of Rochester
www.rochester.edu
Wire Bonder. Wire Bonder. Model: K&S Wire Bonder. Capabilities: This tool is capable of bonding small wires to contact pads using a combination of ultrasonics and heating. Cost: For UR users · For nonUR users. STATUS: Working. Calendar for Reservations: Click here. Specifications: Al wire. ball and wedge bonding ...
Wire Bonders manual and semi-automatic ball conder and wedge bonder...
www.topline.tv
Wire Bonders manual and semi-automatic ball conder and wedge bonder for open cavity QFN packages, Semiconductor and MEMS.
Automatic wire bonder - Bondjet BJ Hesse - manual
www.directindustry.com
A Bonder for manual or automatic bonding The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon. The operating methods from manual to automatic bonding is particularly appropriate fo...
Semi Automatic Wedge Wire Bonder - iBond5000
www.inseto.co.uk
The iBond benchtop semi automatic wire bonder is for ultrasonic Wedge,Tab, Stitch & Ribbon bonding using aluminium, gold or copper wires to a wide range...
iBond5000 Manual Wire Bonder | Platine
portail.polytechnique.edu
Kulicke & Soffa iBond5000 Manual Wire Bonder Wedge and ball bonding of Al wires (20-76μm) Au wires ( μm) and ribbons (up to 25 x 250 μm) Kulicke & Soffa iBond5000 Manual Wire Bonder Wedge and ball bonding of - Al wires (20-76μm) - Au wires ( μm) - ribbons (up to 25 x 250 μm) Heated substrate ...
HYBOND, Inc. - About Wire Bonding
www.hybond.com
Although Peg Bonding is exactly the same as Wedge Bonding, and can be done thermosonically as well as ultrasonically, the main difference with the techniques described earlier is that in a Peg bonder, wire is not fed from a spool of wire by the wire bonder. In a Peg Bonding application, the wire or ribbon (or any ...
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