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Andreas FIX | Bosch, Stuttgart | Division of Automotive Electronicswww.researchgate.net › Bosch

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Wolfgang Nüchter · Jürgen Wilde. Purpose – The purpose of this paper is to investigate the microstructural development of SnAgCu ...

Microstructural development of Sn-Ag-Cu solder joints - SpringerLinklink.springer.com › article

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Fix, Ingo Brauer & Wolfgang Nüchter. Max Planck Institute for Metals ResearchStuttgart, Germany. Gabriel A. López & Eric J. Mittemeijer. Institute of ...

Soldering & Surface Mount Technology: Volume 20 Issue 1www.emerald.com › publication › issn › vol › iss

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Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue · Andreas R. Fix, Wolfgang Nüchter, Jürgen ...

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WOLFGANG NÜCHTER,1 and ERIC J. MITTEMEIJER2–4. 1.—FV/PLV3 Robert Bosch GmbH, Stuttgart, Germany. 2.—Max Planck Institute for. Metals Research,

Microstructural development of Sn-Ag-Cu solder joints | SpringerLink

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[…] Wolfgang Nüchter &; Eric J. Mittemeijer; -Show fewer authors. Journal of Electronic ...

Microstructural changes of lead‐free solder joints during long ...

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... lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue. Andreas Fix 1, Wolfgang Nüchter, Jürgen Wilde• Institutions (1). › papers

Microstructural changes of lead-free solder joints during long-term ...www.emerald.com › insight › content › doi › full › pdf

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Fix, Wolfgang Nüchter and Jürgen Wilde. Soldering & Surface Mount Technology. Volume 20 · Number 1 · · 13– Page 3. solder was prepared by a chemical ...

Alexandra Lerch
Frank Müller
Andreas Schubert

Ingo Brauer
Technischer Wart
Hans Schneider

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Vorname "Wolfgang" (62599)
Name "Nüchter" (188)

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Wolfgang Nüchter und Microstructural Person-Info

Andreas FIX | Bosch, Stuttgart | Division of Automotive Electronicswww.researchgate.net › Bosch

Microstructural development of Sn-Ag-Cu solder joints - SpringerLinklink.springer.com › article

Soldering & Surface Mount Technology: Volume 20 Issue 1www.emerald.com › publication › issn › vol › iss

Microstructural development of Sn-Ag-Cu solder jointslink.springer.com › content › pdf

Microstructural development of Sn-Ag-Cu solder joints | SpringerLink

Microstructural changes of lead‐free solder joints during long ...

Microstructural changes of lead-free solder joints during long-term ...www.emerald.com › insight › content › doi › full › pdf

NAVER 학술정보 > Microstructural changes of lead-free solder joints...

Microstructural changes of lead-free solder joints during long ...

Microstructural development of Sn-Ag-Cu solder joints

Alle Infos zum Namen "Wolfgang Nüchter"