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Lars Titerle - Patents
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Archived* (*May have duplicates - we are upgrading our archive.) Method and device for applying a solder to a substrate ### The bibliographic ...
Business-Profile
patentbuddy: Lars Titerle
PAC TECH - PACKAGING TECHNOLOGIES GMBH, Berlin, DE
Bücher
Microjoining and Nanojoining - Seite Google Books-Ergebnisseitegoogle.com
books.google.com
... Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, 'Laser solder attach for optoelectronics packages', www..pactech.de. Paul P.E. Wang, Steven Perng and ...
Microjoining and Nanojoining - Google Books
books.google.nl
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has...
Dokumente zum Namen
WLCSP PRODUCTION USING ELECTROLESS Ni/Au ...IPC International, Inc.
www.ipc.org
von A Strandjord · Zitiert von: 3 — Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, “High Speed Laser Solder Jetting Technology for. Optoelectronics and MEMS Packaging Seiten
倒装芯片凸点制作方法iczhiku.com
picture.iczhiku.com
von 李福泉 · · Zitiert von: 9 — [9] Elke Zakel ,Lars Titerle ,Thomas Oppert et al. Laser solder ball application for optoelectronics and MEMS packaging. [ C] . OPTATEC , [10] Grerald ... von 李福泉 · · Zitiert von: 9 — [9] Elke Zakel ,Lars Titerle ,Thomas Oppert et al. Laser solder ball application for optoelectronics and MEMS packaging. [ C] . OPTATEC , [10] Grerald ...
Sborník odborného seminářeČVUT
iat.fs.cvut.cz
— Ghassem Azdasht, Lars Titerle. US (A1) Appl. no , Int. Cl. B23K United States Patent and Trademark — Ghassem Azdasht, Lars Titerle. US (A1) Appl. no , Int. Cl. B23K United States Patent and Trademark ...
Wissenschaftliche Veröffentlichungen
Patents Assigned to Pac Tech-Packaging Technologies ...Justia
patents.justia.com
Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT. Publication number ... Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. TRANSFER DEVICE FOR RECEIVING AND TRANSFERRING A SOLDER BALL ARRANGEMENT. Publication number ...
With Means To Remove, Compact, Or Shape Applied Flux ...Justia
patents.justia.com
Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. DESOLDERING DEVICE AND ATTACHMENT THEREOF. Publication number: Abstract: A ... Inventors: Elke Zakel, Paul Kasulke, Oliver Uebel, Lars Titerle. DESOLDERING DEVICE AND ATTACHMENT THEREOF. Publication number: Abstract: A ...
US Patent for Device for positioning a tool in relation to a...
patents.justia.com
Date of Patent: Oct 18, Patent Publication Number: Assignee: Pac Tec-Packaging Technologies GmbH (Nauen (bei Berlin)) Inventors: Elke Zakel (Falkenssee), Paul Kasulke (Berlin), Oliver Uebel (Berlin), Lars Titerle (Berlin) Primary Examiner: Colleen P. Cooke Attorney: Dougherty, Clements & Hofer
US Patent for Method and device for applying material to a ...
patents.justia.com
Inventors: Elke Zakel (Falkensee), Paul Kasulke (Berlin), Oliver Uebel (Berlin), Lars Titerle (Berlin) Primary Examiner: Brian K. Talbot › patent
Veröffentlichungen allgemein
WLCSP PRODUCTION USING ELECTROLESS Ni/Au ...YUMPU
www.yumpu.com
— Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G.Blankenhorn, “High Speed Laser Solder JettingTechnology for Optoelectronics and ...
Sonstiges
3 Dimensional MEMS-PackagingResearchGate
www.researchgate.net
Lars Titerle · Thomas Oppert; Ronald G Blankenhorn. The packaging of optoelectronics and MEMS devices is placing ...
Microjoining and Nanojoining - PDF Free Downloadepdf.tips
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Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, 'Laser solder attach for optoelectronics packages', www..pactech.de. Paul P.E. Wang, Steven ... Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, 'Laser solder attach for optoelectronics packages', www..pactech.de. Paul P.E. Wang, Steven ...
Laser Assisted Soldering and Flip-Chip Attach for MEMS ...DocPlayer.net
docplayer.net
... Proceedings of the Chip Scale International, San Jose CA, September , [4] Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, ... › amp ›
Includes AIMS Harsh Environment Electronics Workshop - PDF Free...
hobbydocbox.com
1 Laser Solder Attach for Optoelectronics Packages Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn* Pac Tech Packaging Technologies GmbH Am ... ›
WAFER-LEVEL SOLDER SPHERE PLACEMENT AND ITS IMPLICATIONS - PDF Free...
hobbydocbox.com
1 Laser Solder Attach for Optoelectronics Packages Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn* Pac Tech Packaging Technologies GmbH ...
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