Venky Sundaram und Fuhan Liu - Info zur Person

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(PDF) Chip-Last Embedded Actives and Passives in Thin Organic Package...

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Chip-Last Embedded Actives and Passives in Thin Organic Package for GHz Multi-Band Applications Fuhan Liu, Venky Sundaram, Sunghwan Min, Vivek...

Fundamental Limits of Organic Packages and Boards and the Need for...

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SOUNAK BANERJI,1 FUHAN LIU,1 SWAPAN BHATTACHARYA,1 VENKY SUNDARAM,1. KEN-ICHI SHINOTANI3 & GEORGE WHITE1. 1Packaging Research ...

TECHNICAL ABSTRACTSwww.qgdigitalpublishing.com/.../article.html

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... in Organic Package Substrates” Authors: Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram and Rao Tummala; .

Fundamental Limits of Organic Packages and Boards and the ...

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von RR Tummala · · Zitiert von: 30 — Rao R. Tummala, P. Markondeya Raj, Shubhra Bansal, Sounak Banerji, Fuhan Liu, Swapan Bhattacharya, Venky Sundaram & George White. › article

Conductive Anodic Filament Failures in Fine-Pitch Through-Via...

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Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates Fuhan Liu, P. Markondeya Raj, Venky Sundaram, ...

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Ravi Doraiswami, Sandeep Sankararaman, Piyush Gupta, Woopoung Kim, Raghav, Madhavan, Zhuqing Zhang, Lianhua Fan, Venky Sundaram, Fuhan Liu, Seyed Hosseini, Madhavan Swaminathan, C.P.Wong, Rao R. Tummala, Optimization of 100 Micron Pitch Lead Free Solder Assembly Process for High Reliability at ...

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— Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram, Rao Tummala. Journal of Electronic Materials. › crossRefTDM

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Venky Sundaram und Fuhan Liu Person-Info