Venky Sundaram und Glass - Info zur Person

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USHIO Installed a Projection Aligner to Develop 2.5 Glass Interposers...

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USHIO installed a projection aligner based on its latest stepper model

Insulation reliability of fine-pitch through-vias in glass fiber...

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P. Markondeya Raj • Venky Sundaram •. Rao Tummala. Received: 18 November Accepted: 4 February Published online:

Glass Packaging R&D for 2.5D, RF, 5G, Photonics, Autonomous

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— Dr. Venky Sundaram, GT-PRC15 | IEEE-CPMT Workshop – Glass Packaging and 2.5D. FIRST Process of Record (POR) for Glass Interposer by GT PRC ... › document

3D Thursday: A quick look at glass interposers for 3D IC assembly |...

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3D InCites just published a short piece on glass interposers for 3D ICs, as discussed at the IMAPS International Device Packaging conference, held March...

Dr. Youngwoo Kim, NAIST - International Conferences

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Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala and Joungho Kim, "Analysis of Power Distribution Network in Glass, Silicon Interposer and ... › view › in...

Design and Demonstration of Glass Panel Embedding for 3D ...

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von S Ravichandran · · Zitiert von: 13 — Venky Sundaram;. Venky Sundaram 1. Search for other works by this author on: This Site · PubMed · Google Scholar. Rao Tummala. Rao Tummala 1. › ar...

Multi-scale thermal modeling of glass interposer for mobile...

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Citation: Sangbeom Cho, Venky Sundaram, Rao Tummala, Yogendra Joshi, ( 2016) "Multi-scale thermal modeling of glass interposer for mobile electronics ...

ECTC Paves the Path to Heterogeneous Integration

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— Venky Sundaram, Chintan Buch, and Rao Tummala (left to right) accept the inaugural 'Corning Leadership in Glass Award' at ECTC ›

Putting Their Money on Glass Interposers | 3D InCites

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While the jury is still out on what role glass interposers will play in the market, glass manufactures are hedging their bets and moving full steam ahead.

Tech Session Highlights from ECTC 2017

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GIT's Venky Sundaram demonstrated a joint development with Disco and Schott, using glass panels for large dies with high I/O density, targeted for high- frequency multi-chip designs. This process offers 1µm L/S and allows a large ratio between the die(s) and package size. Also, the development partners ...

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Venky Sundaram und Glass Person-Info