Venky Sundaram und Rao Tummala - Info zur Person

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ICSJ2014

www.ieee-csj.org

... Nasu, Taiji Sakai, Brett Sawyer, Hao Lu, Yutaka Takagi, Ryuta Furuya, Yuya Suzuki, Makoto Kobayashi, Vanessa Smet, Venky Sundaram, and Rao Tummala.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...

books.google.de

11 P. Markondeya Raj, Saumya Gandhi, Srikrishna Sitaraman, Venky Sundaram, and Rao Tummala, “3D IPAC: a new concept in integrated passive and active ...

EBSCOhost | | Electrodeposited Copper-Graphite Composites...

web.b.ebscohost.com

Electrodeposited Copper-Graphite Composites for. Low-CTE-Integrated Thermal Structures. Shreya Dwarakanath,* P. Markondeya Raj, Kaya Demir, Vanessa Smet, Venky Sundaram, and Rao Tummala. Abstract—Emerging high-power and high-temperature elec- tronic modules require thick copper structures for power ...

Insulation reliability of fine-pitch through-vias in glass fiber...

www.proquest.com

P. Markondeya Raj • Venky Sundaram •. Rao Tummala. Received: 18 November Accepted: 4 February Published online:

TECHNICAL ABSTRACTSwww.qgdigitalpublishing.com/.../article.html

www.qgdigitalpublishing.com

... in Organic Package Substrates” Authors: Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram and Rao Tummala; .

Dr. Youngwoo Kim, NAIST - International Conferences

sites.google.com

Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala and Joungho Kim, "Analysis of Power Distribution Network in Glass, Silicon Interposer and ... › view › in...

Journal of Materials Science: Materials in Electronics

www.springerprofessional.de

Koushik Ramachandran, W. Jud Ready, P. Markondeya Raj, Venky Sundaram, Rao Tummala | Ausgabe Ferroelectric and piezoelectric behavior of (111)-oriented Pb(ZrxTi1−x)O3 thin films on cobalt ferrite nano-seed layered Pt(111)/Si substrate

Awards and Recognitions - Packaging Lab

packaging.fiu.edu

... Best Poster Award, IEEE Electronic Components and Technology Conference, 2011, H. Sharma, K. Sethi, M. Raj, Venky Sundaram, and Rao Tummala, ... › awards-...

Design and Demonstration of Glass Panel Embedding for 3D ...

meridian.allenpress.com

von S Ravichandran · · Zitiert von: 13 — Venky Sundaram;. Venky Sundaram 1. Search for other works by this author on: This Site · PubMed · Google Scholar. Rao Tummala. Rao Tummala 1. › ar...

Institute of Electrical and Electronics Engineers (IEEE) - SMTnet

smtnet.com

Aug 22, | Bhupender Singh, Gary Menezes, Scott McCann, Vidya Jayaram, Urmi Ray, Venky Sundaram, Raj Pulugurtha, Vanessa Smet, Rao Tummala. › company

Multi-scale thermal modeling of glass interposer for mobile...

www.emerald.com

Citation: Sangbeom Cho, Venky Sundaram, Rao Tummala, Yogendra Joshi, ( 2016) "Multi-scale thermal modeling of glass interposer for mobile electronics ...

ECTC Paves the Path to Heterogeneous Integration

www.3dincites.com

— Venky Sundaram, Chintan Buch, and Rao Tummala (left to right) accept the inaugural 'Corning Leadership in Glass Award' at ECTC ›

Ohne Titel

e-jwj.org

— Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram, Rao Tummala. Journal of Electronic Materials. › crossRefTDM

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Venky Sundaram und Rao Tummala Person-Info